منابع مشابه
Stability of Naturally Relevant Ternary Phases in the Cu–Sn–S System in Contact with an Aqueous Solution
A relevant research effort is devoted to the synthesis and characterization of phases belonging to the ternary system Cu–Sn–S, mainly for their possible applications in semiconductor technology. Among all ternary phases, kuramite, Cu3SnS4, mohite, Cu2SnS3, and Cu4Sn7S16 have attracted the highest interest. Numerous studies were carried out claiming for the description of new phases in the terna...
متن کاملPion interferometry in Au + Au and Cu + Cu collisions at √ sN N = 62 . 4 and 200
B. I. Abelev,8 M. M. Aggarwal,30 Z. Ahammed,47 B. D. Anderson,18 D. Arkhipkin,12 G. S. Averichev,11 J. Balewski,22 O. Barannikova,8 L. S. Barnby,2 J. Baudot,16 S. Baumgart,52 D. R. Beavis,3 R. Bellwied,50 F. Benedosso,27 M. J. Betancourt,22 R. R. Betts,8 A. Bhasin,17 A. K. Bhati,30 H. Bichsel,49 J. Bielcik,10 J. Bielcikova,10 B. Biritz,6 L. C. Bland,3 M. Bombara,2 B. E. Bonner,36 M. Botje,27 J....
متن کاملThe Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints
A simple model of the formation of Au0.1Ni0.1Sn0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni3Sn4 alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au0.1Ni0.1Sn0.8 was observed to form at the Pb-Sn solder/Ni3Sn4 interface during annealing a...
متن کاملThermodynamic modelling of the Ag-Cu-Ti ternary system
Ag-Cu-Ti system is important for brazing applications and mainly for ceramic joining. This system is characterized by numerous intermetallics in the Cu-Ti binary and the existence of a miscibility gap in the liquid phase. For applications, the knowledge of phase equilibria, invariant reactions in the temperature range of interest and thermodynamic activity values (mainly of Ti) are important. T...
متن کاملTHERMAL ANALYSIS OF Ag-Cu-In-Sn SYSTEM
In this paper, the results of DSC analysis in Ag-Cu-In-Sn system are presented. Ten samples from the section with constant molar ratio (In:Ag:Cu=7:2:1) were investigated in order to obtain characteristic temperatures of each alloy. The results confirmed the influence of indium on thermal behaviour of these alloys.
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Acta Chemica Scandinavica
سال: 1990
ISSN: 0904-213X
DOI: 10.3891/acta.chem.scand.44-0197